CSP Technology and High Aspect Ratio Bumps.
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 1999
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.2.35